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This definitive collection of AI prompts has been designed to radically transform efficiency in mobile hardware repair shops. Through a rigorous technical structure, each prompt acts as an expert assistant that guides the technician in the resolution of complex failures, from the analysis of initial consumption to critical micro-welding processes. It is the indispensable tool to optimize delivery times and guarantee high quality repairs. By integrating this specialized knowledge into their workflow, hardware professionals will be able to access accurate diagnostic protocols and advanced repair methodologies that minimize the risk of errors. Each section has been curated to cover specific niches of modern microelectronics, allowing the workshop's technical knowledge to scale towards international standards.
Acts as a Senior Microelectronics Engineer and Mobile Device Repair Tools Specialist. Your goal is to develop a comprehensive technical protocol and deployment guide for installing and optimizing the software ecosystem necessary to operate professional hardware programming devices such as [MODELO_Y_MARCA_DE_LA_PROGRAMADORA] (e.g., JCID V1S Pro, QianLi iCopy, WL V6, or Magico Diag). The guide should cover from [VERSION_SISTEMA_OPERATIVO] OS preparation to final validation of connected hardware for iPhone and Android repair services. It begins by detailing the management process of critical drivers. Explains the importance of installing the CH340/CH341 or PL2303 serial communication drivers and how to resolve digital signature conflicts in modern systems. Describes the procedure to verify the correct COM port assignment and latency configuration to ensure that data transfer between the PC and the programming device is stable when reading and writing NAND memories, EEPROM or FaceID modules. It is essential to mention the use of port diagnostic tools to identify bottlenecks in USB communication. Subsequently, delve into the configuration of proprietary software such as [NOMBRE_DEL_SOFTWARE_ASOCIADO] (e.g. JCID Repair, QianLi Helper, WL Tool). Describes the process of creating professional accounts, linking the device's serial number to the manufacturer's server and imperatively updating the internal firmware of the programmer to version [VERSION_FIRMWARE_DESEADA]. Includes a section on configuring proxy servers or network settings required to access cloud databases containing the schematics and backup files required for True Tone and Battery Health data restoration. Develops an advanced section on data security and backup management. Explains step by step how to configure default save paths for binary files (.bin) and configuration files (.txt) extracted from the original components. Provides checksum validation instructions to ensure that the backup has not been corrupted during the read process. This is vital to avoid 'bricking' critical components such as the baseband processor or the proximity sensor illumination module. Finally, establish a preventive maintenance protocol for the workshop software. Recommends specific exclusion settings in antivirus and firewalls to prevent repair executables from being detected as false positives. It concludes with a post-installation checklist that the technician must follow to confirm that the environment is ready for mass production operations or highly complex critical repairs, ensuring that the [NOMBRE_DISPOSITIVO_REPARAR] hardware is instantly recognized when connected. If any key information needed to fill the bracketed fields is missing, ask me the necessary questions before answering.
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He acts as a Senior Microelectronics Engineer and mobile hardware forensic repair expert. Your objective is to write a master level technical protocol for the execution of jumpers and soldering micron cables on the [MODELO_DISPOSITIVO] device. This document must address the complexity of working under a microscope in areas with high component density, where the margin of error is zero and thermal management is critical to not compromise the integrity of the motherboard. Explains in detail the preparation of the [DIAMETRO_CABLE] micron enameled wire and substrate. You must delve into the chemistry of the flux selected for [COMPONENTE_A_REPARAR], analyzing why a specific thermal activation prevents dendrite formation and ensures optimal conductivity. Describes the process of 'pre-tinning' the wire tips, ensuring that the [TIPO_ALEACION] alloy is evenly distributed without creating excess mass that can cause surface tension shorts on adjacent pads. Develops an advanced section on temperature curve control. The technician must know how to compensate for heat dissipation when the pad is connected to a massive ground plane (GND) without overheating sensitive peripheral components such as the processor or memory. Provides instructions on the angle of attack of the [TIPO_PUNTA_CAUTIN] tip and the exact pressure (in grams of theoretical force) to achieve a perfect intermetallic bond without mechanically deforming the copper pad. Instructs on the mechanical stabilization and isolation phase. Details the use of ultraviolet (UV) mask for anchoring the micro-cable, specifying the application pattern to prevent vibration from daily use from breaking the solder. Includes curing parameters with the [MODELO_LAMPARA_UV] lamp, mentioning the wavelength and time needed to prevent the resin from becoming sticky or brittle. The end result should be an invisible, functional and aesthetically professional repair under inspection by [NIVEL_AUMENTO]x. Finally, it generates a post-operative quality verification guide. Defines the diode mode voltage drop values expected after the repair and how to interpret the multimeter readings to rule out current leakage. Includes a troubleshooting section for scenarios where the solder does not 'wet' the pad or where a cold joint occurs due to invisible oxidation of the enameled copper wire. If any key information needed to fill the bracketed fields is missing, ask me the necessary questions before answering.
Acts as a Senior Microelectronics and High-End Mobile Device Repair Specialist, with a critical focus on preserving the structural integrity of OLED and LCD components. Your goal is to provide a comprehensive technical and procedural guide on the use of vacuum suction tools or high-pressure suction cups (such as the iSclack or industrial lever suction cups) for the safe opening of the model [MODELO_DISPOSITIVO]. The process must begin by analyzing the physics of the chemical adhesion present in the device, considering whether the sealing is by IP68 perimeter adhesive or by pressure clips. It explains in detail how the application of controlled heat at a temperature of [NIVEL_CALOR] degrees Celsius affects the viscosity of the glue and why the suction cup must be strategically positioned to avoid damage to the front camera area or proximity sensors. Describes the 'constant tension vs. brute force' to allow the adhesive to elongate and yield without fracturing the outer glass. Develop an analysis on the ideal insertion point once the pressure suction cup has generated the first 'gap' or opening space. Instructs the user how to maintain suction while inserting plastic separation tools (tines or mediators) to cut remaining adhesive. You should include specific warnings about the insertion depth of the additional tools to avoid damaging the screen flexors or the internal battery, which are extremely vulnerable on the [MODELO_DISPOSITIVO] model due to its internal [TIPO_ARQUITECTURA] architecture. Finally, it provides a safety protocol for cases where the glass is previously fractured, detailing the use of highly transparent adhesive tape to create a smooth surface that allows the suction cup to generate the necessary vacuum. The tone should be professional, technical, and extremely cautious, prioritizing hardware security over the speed of the repair process. Consider using the [HERRAMIENTA_SUCCION_ESPECIFICA] tool as the gold standard for this procedure. If any key information needed to fill the bracketed fields is missing, ask me the necessary questions before answering.
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Based on 8 reviews
Best purchase I made this month. They work just as well in ChatGPT and Claude. An investment that pays for itself.
I didn't expect them to be this complete. They're easy to adapt to my case by just changing the fields. Already recommended them to my team.
I didn't expect them to be this complete. They saved me hours of work in the first week. Already recommended them to my team.
Exactly what I was looking for. They saved me hours of work in the first week. I'll buy again without hesitation.
Exceeded my expectations. They saved me hours of work in the first week. Already recommended them to my team.
Best purchase I made this month. The prompts are really well thought out and the effort shows. An investment that pays for itself.
Best purchase I made this month. They work just as well in ChatGPT and Claude. An investment that pays for itself.
It's fine, nothing more. I had to tweak them quite a bit for my case. Could be better but useful.